Features of board-to-board connectors
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At present, the board-to-board connectors used in mobile phones mainly have the following characteristics: First, it is "flexible", flexible connection, and has strong corrosion resistance; secondly, no welding is required, easy installation, and no fire hazard This also saves space; Moreover, today's board-to-board are all ultra-low height, two-piece, this point, the editor will focus on this point; after Z, it has super environmental resistance, not just soft, Moreover, it adopts a "sturdy connection" with high contact reliability; of course, it generally has the advantages of unlimited pipes, sealing under pressure, and convenient installation.
We all know that Japanese companies have always been at the leading level in the connector field. Many domestic high-end mobile phones use board-to-board connectors from Japanese companies such as Matsushita Electric Works to achieve the purpose of reducing the thickness of the body. Matsushita Electric Works is also The current world Z low board-to-board connector combination height is 0.6mm. The good news is that I learned that the domestic Yaqi Technology has also developed and produced this high-level board-to-board connector, and it is also serving the majority of Shenzhen white-brand mobile phone companies. It is understood that it has also entered many well-known domestic brand mobile phone customers. Supply chain system, which is not a “good news” for reducing the cost of mobile phone hardware and enhancing product competitiveness! In order to improve the combination of sockets and plugs, a simple locking mechanism is adopted in the fixed metal parts and contact parts. While improving the combination force, it has a more plug-in sense when locked. This connector can greatly reduce the thickness of the product to achieve the purpose of connection, and this has led to more and more ultra-thin mobile phones on the market! The pitch of the pins is getting narrower and narrower. At present, 0.4mm pitch is the main focus. Now JAE and Yaqi Technology have developed a 0.35mm pitch, which should be the industry's so far Z-narrow pitch board-to-board connector. The 0.35mm pitch is currently Mainly used for Apple mobile phones and domestic high-end models. Its application will be a major trend in the past two years. It has the advantages of less volume, high precision, and high performance, but it has more requirements for patch and other supporting technologies. High, this is where many connector manufacturers Z need customer service, otherwise the yield rate will be very low.
Today, when consumers have higher and higher requirements for product thickness and hand feel experience, ultra-thin and ultra-narrow connectors put new requirements on the electroplating process. For products with a height of 0.6mm and a single product less than 0.4 mm in height, How to ensure that the product's gold plating thickness and the effect of tin plating do not climb tin have become a key problem in connector miniaturization. At present, the common practice in the industry is to block the tin path through laser peeling of the gold plating layer, thereby solving the problem of not climbing tin. However, this technology has a disadvantage that when stripping gold, the laser will also damage the nickel-plated layer, so that the copper is exposed to the air, which will corrode and rust.
According to our understanding, the Japanese company Matsushita Electrician and the domestic Yaqi Technology have a new solution for this. Through the electroplating process, the pin root of the terminal is plated with a nickel-exposed area less than 0.08mm, which has successfully solved this problem. problem. Believe this, many engineers and technical experts should understand that the 0.08mm nickel-exposed area is currently only available to individual international companies with strong technical strength!
Now I have to mention that the board-to-board connector can be constructed for simple machine circuit design. By installing an insulating wall on the bottom of the connector, the PC board can be routed and wired on the bottom of the connector without contacting the metal terminals, which is very beneficial for the miniaturization of the PC board!
Z-narrow-pitch board-to-board connectors. 0.35mm pitch is currently mainly used in Apple mobile phones and domestic high-end models. Its application will be a major trend in the past two years. It has a small volume, high precision, and high Performance and other advantages, but higher requirements for matching processes such as patching, this is where many connector manufacturers Z need customer service, otherwise the yield rate will be very low.
Today, when consumers have higher and higher requirements for product thickness and hand feel experience, ultra-thin and ultra-narrow connectors put new requirements on the electroplating process. For products with a height of 0.6mm and a single product less than 0.4 mm in height, How to ensure that the product's gold plating thickness and the effect of tin plating do not climb tin have become a key problem in connector miniaturization. At present, the common practice in the industry is to block the tin path through laser peeling of the gold plating layer, thereby solving the problem of not climbing tin. However, this technology has a disadvantage that when stripping gold, the laser will also damage the nickel-plated layer, so that the copper is exposed to the air, which will corrode and rust.
According to our understanding, the Japanese company Matsushita Electrician and the domestic Yaqi Technology have a new solution for this. Through the electroplating process, the pin root of the terminal is plated with a nickel-exposed area less than 0.08mm, which has successfully solved this problem. problem. Believe this, many engineers and technical experts should understand that the 0.08mm nickel-exposed area is currently only available to individual international companies with strong technical strength!
Now I have to mention that the board-to-board connector can be constructed for simple machine circuit design. By installing an insulating wall on the bottom of the connector, the PC board can be routed and wired on the bottom of the connector without contacting the metal terminals, which is very beneficial for the miniaturization of the PC board!
